Led tech industry in Taiwan is quite important a ring, with the LED in lighting applications, the permeability increased year by year, many manufacturers also began to think, LED technology import into other end use applications.And this year's summit, the audience focused on market opportunities and terminal application of the discussion, the interesting is that CSP (Scale Package Chip; wafer level packaging) technology, has become one of the focus of the forum speakers focus.

 

LED chip package is quite diverse, many take vertical flip chip package FilpChip practice, most of the cost is quite high, but if you take the other package approach, although can effectively reduce the cost, but in efficiency performance might be made more discounts, such as if the fruit industry together to create a new ecological system, further for packaging technology facing the problem, it may be possible to will solve the problem.

 

However, although CSP has also been developing for several years, whether the major R & D technology will appear the problem of plagiarism?Due to the CSP involves a wide range, from the point of view of system integration, each knot interlocking, light is a problem of heat dissipation, to achieve optimal, they spend a lot of time, which covers quite a lot of knowledge, so it is not likely to happen this situation.